Email this article Analysis of Hyoid Structured And Perforated Pinfin Heat Sink In Inline And Staggered Flow
Abstract
The usage of the electronic goods has been increased tremendously; hence it is the challenging task to improve the cooling for such devices. The heat dissipation rate should be maximized in the electronic devices like integrated CPUs, chipset and hard disk drives with the help of heat sinks, fans and other forms like liquid cooling in order to protect the device due to overheating,as overheating results in reducing the life or damaging the device, hence it is necessary to modify the heat sink design in various vital parameters like fin height, fin length, fin thickness, number of fins, number of perforations, base plate thickness, fin spacing, material etc.
The main objective of this present paper is to present the modified model of the heat sink with above mentioned geometrical parameters, and both flow types of inline and staggered with and without perforations of C/H=0, C/H=0.333, and C/H=1; =1.308, 500 < Re < 42,000; 1.208 < Sy/D < 3.417, 0 < C/H < 1 and observing the heat flow rate in the Hyoid (U-shaped) pin fin heat sink.
The results revealed improved heat dissipation characteristics
Keywords
References
Jonsson,H., and Bjorn, P.,”Experimental Comparison of Different Heat Sink Designs for cooling of Electronics”, American Society of Mechanical Engineers ,Heat Transfer Division,HTD,Vol.329,No.7,Association of Mechanical Engineers, New York,1996,pp.27-34.
Khan, W. A., 2004, “Modeling of Fluid Flow and Heat Transfer for Optimization of
Pin-Fin Heat Sinks,” Ph. D. Thesis, Department of Mechanical Engineering, University
Of Waterloo, Canada.
Mousa, A.H., "Enhancement of thermal performance of fins subjected to natural convection through body perforation", Ph.D. thesis, Mech. Eng., Baghdad university, 2000.
Yang., W.J., "Three kinds of heat transfer augmentation in perforated surfaces", Letters in H. and M.T., Vol.5, 1978.
Kodandaraman, C.P., Heat and Mass Transfer Data Book.
P. K. Nag, 2006, “Heat & Mass Transfer”, nineth Edition, Tata McGraw Hill Co. Pg. No. : 86-108 & 425-449
J. P. Holman, 2004, “Heat Transfer”, Tata McGraw Hill Co,” Pg. No. 43-53 & 315-350
Yunus A. Çengel, 2004, “Heat Transfer- A Practical Approach”, SI units 2nd Edition, Tata McGraw Hill Co., Pg. No. : 156-168, 3
Giovanni Tanda, PERGAMON, International Journal of Heat and Mass Transfer 44 (2001) 3529-3541.
Tzer-Ming Jeng,Sheng-Chungzeng, ELSEVIER, International Journal of Heat and Mass Transfer 50 (2007) 2364–2375
Refbacks
- There are currently no refbacks.
Copyright © 2013, All rights reserved.| ijseat.com
International Journal of Science Engineering and Advance Technology is licensed under a Creative Commons Attribution 3.0 Unported License.Based on a work at IJSEat , Permissions beyond the scope of this license may be available at http://creativecommons.org/licenses/by/3.0/deed.en_GB.